PCR Technologies has pioneered the development and implementation of new technologies in the industry, including a heatsink to PC board bonding process that is compatible with electrostatic sensitive components (ESD) which enables heatsinks of the circuit card assembly to be laminated after the installation of surface mount components. This enables greater flexibility in building mixed technology surface mount assemblies and eliminates the problems associated with sending a large thermal mass through a surface mount process.
We posses extensive experience in working with a wide variety of printed circuit board and heatsink bonding materials-allowing your process to be transitioned generally without design changes. PCR Technologies provides product delivery that is timely and price-competitive.
PCR Technologies uses a variety of bonding materials in our processes, including:
| • Pyralux |
• Ablefilm |
| • Thermabond |
• Cybond |
| • Nitro Phenolic |
• Kapton |
| • No-Flow Prepregs |
• Wet Lay-up: 2 part epoxies (all types) |
Minimization of hard tooling in process manufacturing enables process changes to be incorporated quickly and efficiently, usually without impacting delivery, and with minimal non-recurring cost. This reduces another cost that often impacts many programs transitioning into production.
Additional value added items can also be included to your printed circuit board assembly such as silk screening, riveting, card retainer installation.
PCR Technologies's customer responsiveness includes our ability to communicate directly with clients' trained manufacturing engineering staff to resolve production issues without a level of intermediaries. This enables easy, rapid and exact translation of customer needs and allows problems to be resolved quickly and efficiently.
|
