Callcall today: 973.882.0017Email: sales@pcrtechnologies.com
CUSTOM CAPABILITIESHeat Sink FabricationAdhesive Preforms/
Insulators
Heat Sink To Circuit Board
Bonding
Metal Core HeatsinksHigh Speed CNC
Machining-Metals
Plastic G-10/Fr-4 MachiningExtruded Heatsinks
RF / Microwave Component
Housings
PAST WORK PORTFOLIOCNC Milling of a G-10/FR-4
Cover
CNC Milling of an Aluminum
RF / Microwave Housing
Bonding of an Aluminum
Heatsink
CNC Milling of an Aluminum
Heatsink
CNC Milling of an Aluminum
Case
CNC Routing of a Pyralux &
Polymide Adhesive Preform

RF & Microwave Machined Components

RF & Microwave Machined Components

Experts in machining and bonding RF & microwave components, we employ substrate bonding, selective solder bonding, and sweat solder bonding (vapor phase) to achieve parts that are uniform, virtually void free, highly repeatable, with no discoloration, and minimal solder flow.

Our commitment to consistent quality and repeatability is evident in our ability to meet positioning tolerances of +/-.0002" and repeatability of +/-.0001".  At PCR Technologies, we have the equipment required to perform precision high-speed CNC machining on parts up to 30" long and up to 20" wide.

From prototype to large-scale production runs, our facilities are able to meet exacting expectations on tight deadlines, typically within 3-6 weeks, as well as quicker turnaround times when required.

ISO 9001:2008-certified, ITAR registered, and RoHS compliant; proficient in a wide range of file formats including (DXF, DWG, IGES, STP, and STEP, to name just a few). We have provided RF/microwave machined components for the breakthrough work in such industries as aerospace/defense, satellite, and telecommunications. Competent, reliable, and innovative, we are the ideal business partners and deliver products that go beyond standard expectations of a manufacturer.

For more information on our RF and microwave component housings, see the table below or contact us directly.

Request A Quote

Portfolios

RF & Microwave Component Machining & Bonding Capabilities

General RF
Microwave
Components Housings
Carrier Plates
Amplifiers
Filters
Converters
Modules
Process
Circuit Bonding
Selective Solder Bonding
Substrate Bonding
Sweat Solder Bonding (Vapor Phase)
Benefits
Uniform
Virtually Void Free
High Repeatability
No Discoloration
Minimal Solder Flow
Supplemental Fabrication Operations
Silk Screen Marking
Mechanical Assembly
Engraving
NADCAP Plating
Equipment
CNC Machining Centers
Multiple Spindle CNC Routing Machines
Multiple Spindle CNC Drilling Machines
CNC Milling Machines
Drill Presses
Sheet Metal Forming Equipment
Sheet Metal Shearing Equipment
Lathe
Quality Continuous Improvement
ISO 9001:2008
AS 9102 F.A.I.R.
Production Volume Prototype to Large Scale Production Runs
Typical Lead Time 3 to 6 weeks
Quick Turn Available
Additional Information
Industry Focus
Military/Defense
Aerospace
Marine
Satellite
Telecommunications
Industrial Electronics
Industry Standards
ISO 9001:2008 Certified
ITAR Registered
RoHS Compliant
AS 9102 F.A.I.R.
Efficiency Lean Manufacturing
File Formats
Electronic Data Interchange
DXF
DWG
IGES
STP
STEP
PRO-E
SLDPRT

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