Heat Sink to Circuit Board Bonding

PCR Technologies, Inc. offers heatsink to circuit board bonding (PCB/PWB bonding) utilizing conductive adhesives, sweat solder bonding (vapor phase) and ESD for populated SMT assemblies. By means of bonding and laminating, and through command of working with pyralux, ablefilm, thermabond, cybond, nitro phenolic, kapton, and wet lay-up epoxies, we are able to provide cutting-edge solutions for numerous industrial applications. All of our bonding services are also compliant with electrostatic sensitive components. Our prototype and production run capabilities are generally two to four weeks, however quicker turnaround times are available upon request.

For more information on our heatsink to circuit board bonding abilities, see the table below or contact us directly.

Portfolios

Circuit Board Bonding Capabilities

General Products

Heatsink to PCB/PWB Bonding
RF Microwave – Conductive Adhesives

Sweat Solder Bonding – Vapor Phase
ESD for Populated SMT Assemblies

Process: Bonding
Laminating

Quality: Continuous Improvement
ISO 9001:2015 & AS9100D Certified
AS9102 F.A.I.R. available upon request

Compatible with: Electrostatic Sensitive Components (ESD)

Materials

Pyralux
Ablefilm
Thermabond
Cybond

Nitro Phenolic
Kapton
No-Flow Prepregs
Wet Lay-up: 2 part epoxies (all types)

Supplemental Fabrication Operations

Silk Screen Marking
Mechanical Assembly
Engraving
Painting
NADCAP Plating

Bending
Riveting
Card Retainer Installation
Hardware Installation

Production Volume: Prototype to Large Scale Production Runs

Additional Information

Industry Focus

Military/Defense
Aerospace
Marine
Satellite
Telecommunications

Industrial Electronics
Transportation – Auto/Truck/Rail
Architectural
Signal Control

Industry Standards

ISO 9001:2015 & AS9100D Certified
ITAR Registered

RoHS Compliant
AS 9102 F.A.I.R.

Efficiency: Lean Manufacturing

File Formats

Electronic Data Interchange
DXF
DWG
IGES

STP
STEP
PRO-E
SLDPRT